Abstract
For a test system consisting of a pressure sensor that works based on a reference pressure and a deliberately placed de - fect, the use of pressure bombing for the detection of very small leaks on waferlevel was tested. Furthermore, a simpli - fied modeling approach was used in order to be able to predict the effects of pressure bombing on an observed leak, as well as obtain information on the expected dimensions of the leakage path.
| Translated title of the contribution | Waferlevel Hermeticity Test for Pressure Sensors |
|---|---|
| Original language | German |
| Title of host publication | MikroSystemTechnik Kongress 2021 |
| Subtitle of host publication | Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings |
| Publisher | VDE-Verlag GmbH, Berlin, Offenbach |
| Pages | 691-693 |
| Number of pages | 3 |
| ISBN (Electronic) | 9783800756575 |
| Publication status | Published - 2021 |
| Event | MikroSystemTechnik Congress 2021: Microelectronics, Microsystems Engineering and their Applications - Innovative Products for Future-Oriented Markets - Stuttgart-Ludwigsburg, Germany Duration: 8 Nov 2021 → 10 Nov 2021 |
Conference
| Conference | MikroSystemTechnik Congress 2021 |
|---|---|
| Country/Territory | Germany |
| City | Stuttgart-Ludwigsburg |
| Period | 8/11/21 → 10/11/21 |
ASJC Scopus subject areas
- Hardware and Architecture
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
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