Abstract
A modular system-level Electrostatic Discharge (ESD) evaluation platform is described. It forms a flexible instrument which allows the investigation of the impact of various system-level and Printed Circuit Board (PCB) ESD design choices. The Transmission Line Pulse (TLP) and IEC 61000-4-2 pulse behavior of a Universal Serial Bus USB) 3.0 re-driver IC protected by different Transient Voltage Suppressors (TVS) is investigated. The system includes modules with varying functionality which can be flexibly combined on a baseboard. IV curves, leakage current, S-parameters, USB data errors and IC power consumption can be monitored to detect damage or soft fail disturbances. We report on the ESD protection achieved with two types of TVS: TVS with and without snap-back characteristics. The measured voltages and currents are compared to a System Efficient ESD Design (SEED) simulation. This modular system allows rapid implementation of complex experimental characterization setups to investigate system level ESD response, providing essential input to improve design robustness using the SEED modelling concept.
| Original language | English |
|---|---|
| Article number | 2000308 |
| Journal | IEEE Transactions on Instrumentation and Measurement |
| Volume | 74 |
| DOIs | |
| Publication status | E-pub ahead of print - 13 Nov 2024 |
Keywords
- Electrostatic discharge (ESD)
- system-efficient ESD design (SEED)
- transient voltage suppressor (TVS)
- transmission line pulse (TLP)
- Universal Serial Bus (USB) re-driver
ASJC Scopus subject areas
- Instrumentation
- Electrical and Electronic Engineering