Electromagnetic Emission Scanning at the Surface of ICs

Bernd Deutschmann; Andreas Gleinser; Philipp Reitter

Electromagnetic Emission Scanning at the Surface of ICs

Bernd Deutschmann
, Andreas Gleinser
, Philipp Reitter

Institute of Electronics (4390)

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Abstract

With increasing density of components in modern ICs, their electromagnetic compatibility (EMC) becomes more and more a design factor to consider. A lot of interference problems of electronic systems originate form high electromagnetic emission and low immunity of the used ICs. The so-called surface scan method provides a useful measurement technique to highlight origins of emissions
directly at the surface of IC packages or microchips. It is based on measuring electric- as well as magnetic near fields at the surface of ICs by automatically
moving a probe in 3 axis over the device. This technique enables the visualization of the distribution of E- and Hfields emitting from the surface of the device and thereby helps to identify and analyze emission hotspots.

Original language	English
Title of host publication	15. EMV-Fachtagung
Subtitle of host publication	OVE Schriftenreihe Nr. 87
Editors	Gunter Winkler
Place of Publication	Wien
Publisher	Österreichischer Verband für Elektrotechnik
Pages	16
Number of pages	1
Volume	87
ISBN (Print)	3-85133-093-5
Publication status	Published - 26 Apr 2017

Keywords

EMC, Surface Scan, Emission, IC

ASJC Scopus subject areas

General Engineering

Fields of Expertise

Information, Communication & Computing

1 Anthology

15. EMV-Fachtagung
Winkler, G. (Editor), 2017, Wien: Österreichischer Verband für Elektrotechnik. 245 p. (OVE-Schriftenreihe; vol. 87)
Research output: Book/Report › Anthology

Cite this

@inproceedings{422d3ca426114154b90fb9c0227de2b2,

title = "Electromagnetic Emission Scanning at the Surface of ICs",

abstract = "With increasing density of components in modern ICs, their electromagnetic compatibility (EMC) becomes more and more a design factor to consider. A lot of interference problems of electronic systems originate form high electromagnetic emission and low immunity of the used ICs. The so-called surface scan method provides a useful measurement technique to highlight origins of emissions directly at the surface of IC packages or microchips. It is based on measuring electric- as well as magnetic near fields at the surface of ICs by automatically moving a probe in 3 axis over the device. This technique enables the visualization of the distribution of E- and Hfields emitting from the surface of the device and thereby helps to identify and analyze emission hotspots.",

keywords = "ESD, Wunsch Bell Charakterisitk, EMV, transient disturbance, EMC, Surface Scan, Emission, IC",

author = "Bernd Deutschmann and Andreas Gleinser and Philipp Reitter",

year = "2017",

month = apr,

day = "26",

language = "English",

isbn = "3-85133-093-5",

volume = "87",

pages = "16",

editor = "Gunter Winkler",

booktitle = "15. EMV-Fachtagung",

publisher = "{\"O}sterreichischer Verband f{\"u}r Elektrotechnik",

}

TY - GEN

T1 - Electromagnetic Emission Scanning at the Surface of ICs

AU - Deutschmann, Bernd

AU - Gleinser, Andreas

AU - Reitter, Philipp

PY - 2017/4/26

Y1 - 2017/4/26

N2 - With increasing density of components in modern ICs, their electromagnetic compatibility (EMC) becomes more and more a design factor to consider. A lot of interference problems of electronic systems originate form high electromagnetic emission and low immunity of the used ICs. The so-called surface scan method provides a useful measurement technique to highlight origins of emissions directly at the surface of IC packages or microchips. It is based on measuring electric- as well as magnetic near fields at the surface of ICs by automatically moving a probe in 3 axis over the device. This technique enables the visualization of the distribution of E- and Hfields emitting from the surface of the device and thereby helps to identify and analyze emission hotspots.

AB - With increasing density of components in modern ICs, their electromagnetic compatibility (EMC) becomes more and more a design factor to consider. A lot of interference problems of electronic systems originate form high electromagnetic emission and low immunity of the used ICs. The so-called surface scan method provides a useful measurement technique to highlight origins of emissions directly at the surface of IC packages or microchips. It is based on measuring electric- as well as magnetic near fields at the surface of ICs by automatically moving a probe in 3 axis over the device. This technique enables the visualization of the distribution of E- and Hfields emitting from the surface of the device and thereby helps to identify and analyze emission hotspots.

KW - ESD, Wunsch Bell Charakterisitk, EMV, transient disturbance

KW - EMC, Surface Scan, Emission, IC

M3 - Conference paper

SN - 3-85133-093-5

VL - 87

SP - 16

BT - 15. EMV-Fachtagung

A2 - Winkler, Gunter

PB - Österreichischer Verband für Elektrotechnik

CY - Wien

ER -

Electromagnetic Emission Scanning at the Surface of ICs

Abstract

Keywords

ASJC Scopus subject areas

Fields of Expertise

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Research output

15. EMV-Fachtagung

Cite this