Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis

Runbing Hua; Omid Hoseini Izadi; Zhekun Peng; Hideki Shumiya; Shota  Konno; Kenji Araki; David Johannes Pommerenke; DongHyun Kim

doi:10.1109/EMCSI38923.2020.9191592

Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis

Runbing Hua
, Omid Hoseini Izadi
, Zhekun Peng
, Hideki Shumiya
, Shota Konno
, Kenji Araki
, David Johannes Pommerenke
, DongHyun Kim

Institute of Electronics (4390)

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Abstract

An electrostatic discharge (ESD) happening on a commercial electronic device such as at the USB interface can induce soft-failure in the IC and disturb the normal operation of the device. This paper investigates the soft-failure behaviors of 14 commercial USB devices in order to obtain an insight into the overall sensitivity trend of such systems and into the severity of different soft-failures. A new analysis method is proposed in this paper. The considered parameters in this study include: injected pulse widths, pulse rise time, current levels, USB standard of the DUTS, etc. Soft-failures started to occur at a current of around 1 A, and nearly all configurations would show errors above 6 A.

Original language	English
Title of host publication	2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020
Pages	200-204
Number of pages	5
ISBN (Electronic)	978-1-7281-7430-3
DOIs	https://doi.org/10.1109/EMCSI38923.2020.9191592
Publication status	Published - Jul 2020
Event	2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity: EMCSI 2020 - Virtual, Reno, United States Duration: 27 Jul 2020 → 31 Jul 2020

Conference

Conference	2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity
Abbreviated title	EMCSI 2020
Country/Territory	United States
City	Virtual, Reno
Period	27/07/20 → 31/07/20

Keywords

electrostatic discharge
soft-failure
USB IC susceptibility

ASJC Scopus subject areas

Information Systems and Management
Safety, Risk, Reliability and Quality
Signal Processing
Radiation
Electrical and Electronic Engineering

Access to Document

10.1109/EMCSI38923.2020.9191592

Cite this

Hua, R., Izadi, O. H., Peng, Z., Shumiya, H., Konno, S., Araki, K., Pommerenke, D. J., & Kim, D. (2020). Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis. In 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020 (pp. 200-204). Article 9191592 https://doi.org/10.1109/EMCSI38923.2020.9191592

Hua, R, Izadi, OH, Peng, Z, Shumiya, H, Konno, S, Araki, K, Pommerenke, DJ & Kim, D 2020, Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis. in 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020., 9191592, pp. 200-204, 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, Virtual, Reno, United States, 27/07/20. https://doi.org/10.1109/EMCSI38923.2020.9191592

@inproceedings{5f6f8a361fca4253aa848ea2a642db54,

title = "Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis",

abstract = "An electrostatic discharge (ESD) happening on a commercial electronic device such as at the USB interface can induce soft-failure in the IC and disturb the normal operation of the device. This paper investigates the soft-failure behaviors of 14 commercial USB devices in order to obtain an insight into the overall sensitivity trend of such systems and into the severity of different soft-failures. A new analysis method is proposed in this paper. The considered parameters in this study include: injected pulse widths, pulse rise time, current levels, USB standard of the DUTS, etc. Soft-failures started to occur at a current of around 1 A, and nearly all configurations would show errors above 6 A.",

keywords = "electrostatic discharge, soft-failure, USB IC susceptibility",

author = "Runbing Hua and Izadi, \{Omid Hoseini\} and Zhekun Peng and Hideki Shumiya and Shota Konno and Kenji Araki and Pommerenke, \{David Johannes\} and DongHyun Kim",

year = "2020",

month = jul,

doi = "10.1109/EMCSI38923.2020.9191592",

language = "English",

pages = "200--204",

booktitle = "2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020",

note = "2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity : EMCSI 2020, EMCSI 2020 ; Conference date: 27-07-2020 Through 31-07-2020",

}

TY - GEN

T1 - Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis

AU - Hua, Runbing

AU - Izadi, Omid Hoseini

AU - Peng, Zhekun

AU - Shumiya, Hideki

AU - Konno, Shota

AU - Araki, Kenji

AU - Pommerenke, David Johannes

AU - Kim, DongHyun

PY - 2020/7

Y1 - 2020/7

N2 - An electrostatic discharge (ESD) happening on a commercial electronic device such as at the USB interface can induce soft-failure in the IC and disturb the normal operation of the device. This paper investigates the soft-failure behaviors of 14 commercial USB devices in order to obtain an insight into the overall sensitivity trend of such systems and into the severity of different soft-failures. A new analysis method is proposed in this paper. The considered parameters in this study include: injected pulse widths, pulse rise time, current levels, USB standard of the DUTS, etc. Soft-failures started to occur at a current of around 1 A, and nearly all configurations would show errors above 6 A.

AB - An electrostatic discharge (ESD) happening on a commercial electronic device such as at the USB interface can induce soft-failure in the IC and disturb the normal operation of the device. This paper investigates the soft-failure behaviors of 14 commercial USB devices in order to obtain an insight into the overall sensitivity trend of such systems and into the severity of different soft-failures. A new analysis method is proposed in this paper. The considered parameters in this study include: injected pulse widths, pulse rise time, current levels, USB standard of the DUTS, etc. Soft-failures started to occur at a current of around 1 A, and nearly all configurations would show errors above 6 A.

KW - electrostatic discharge

KW - soft-failure

KW - USB IC susceptibility

UR - https://www.scopus.com/pages/publications/85091866054

U2 - 10.1109/EMCSI38923.2020.9191592

DO - 10.1109/EMCSI38923.2020.9191592

M3 - Conference paper

SP - 200

EP - 204

BT - 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020

T2 - 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity

Y2 - 27 July 2020 through 31 July 2020

ER -

Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis

Abstract

Conference

Keywords

ASJC Scopus subject areas

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