3D Printed Electromagnetic Absorber Built with Conductive Carbon-filled Filament

Rui Mi; Wei Zhang; Kaustav Ghosh; Sameer Walunj; Qian Liu; Jacques Rollin; Philippe Sochoux; David Pommerenke; Victor Khilkevich

doi:10.1109/EMC/SI/PI/EMCEurope52599.2021.9559309

3D Printed Electromagnetic Absorber Built with Conductive Carbon-filled Filament

Rui Mi
, Wei Zhang
, Kaustav Ghosh
, Sameer Walunj
, Qian Liu
, Jacques Rollin
, Philippe Sochoux
, David Pommerenke
, Victor Khilkevich

Institute of Electronics (4390)

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Abstract

This article presents a method for manufacturing a frequency selective surface (FSS) using the 3D printing technology, including material characterization, design, fabrication, and evaluation. The FSS design is based on a three-layer structure. The first layer is a 3D printed lossy material, the second layer is an air gap, and the third layer is a ground plane. By changing the geometrical parameters of the 3D printed layer, it is possible to tune the frequency of the absorption band of the FSS.

Original language	English
Title of host publication	2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021
Publisher	IEEE
Pages	266-271
Number of pages	6
ISBN (Electronic)	9781665448888
DOIs	https://doi.org/10.1109/EMC/SI/PI/EMCEurope52599.2021.9559309
Publication status	Published - 26 Jul 2021
Event	2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe: EMC/SI/PI/EMC Europe 2021 - Raleigh, United States Duration: 26 Jul 2021 → 20 Aug 2021

Publication series

Name	2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021

Conference

Conference	2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe
Abbreviated title	EMC/SI/PI/EMC Europe 2021
Country/Territory	United States
City	Raleigh
Period	26/07/21 → 20/08/21

Keywords

3D printing
conductive lossy material
frequency selective surface
radiated emissions

ASJC Scopus subject areas

Signal Processing
Energy Engineering and Power Technology
Aerospace Engineering
Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
Radiation

Access to Document

10.1109/EMC/SI/PI/EMCEurope52599.2021.9559309

Cite this

Mi, R., Zhang, W., Ghosh, K., Walunj, S., Liu, Q., Rollin, J., Sochoux, P., Pommerenke, D., & Khilkevich, V. (2021). 3D Printed Electromagnetic Absorber Built with Conductive Carbon-filled Filament. In 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021 (pp. 266-271). (2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021). IEEE. https://doi.org/10.1109/EMC/SI/PI/EMCEurope52599.2021.9559309

3D Printed Electromagnetic Absorber Built with Conductive Carbon-filled Filament. / Mi, Rui; Zhang, Wei; Ghosh, Kaustav et al.
2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021. IEEE, 2021. p. 266-271 (2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Mi, R, Zhang, W, Ghosh, K, Walunj, S, Liu, Q, Rollin, J, Sochoux, P, Pommerenke, D & Khilkevich, V 2021, 3D Printed Electromagnetic Absorber Built with Conductive Carbon-filled Filament. in 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021. 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021, IEEE, pp. 266-271, 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, Raleigh, United States, 26/07/21. https://doi.org/10.1109/EMC/SI/PI/EMCEurope52599.2021.9559309

Mi R, Zhang W, Ghosh K, Walunj S, Liu Q, Rollin J et al. 3D Printed Electromagnetic Absorber Built with Conductive Carbon-filled Filament. In 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021. IEEE. 2021. p. 266-271. (2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021). doi: 10.1109/EMC/SI/PI/EMCEurope52599.2021.9559309

Mi, Rui ; Zhang, Wei ; Ghosh, Kaustav et al. / 3D Printed Electromagnetic Absorber Built with Conductive Carbon-filled Filament. 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021. IEEE, 2021. pp. 266-271 (2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021).

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abstract = "This article presents a method for manufacturing a frequency selective surface (FSS) using the 3D printing technology, including material characterization, design, fabrication, and evaluation. The FSS design is based on a three-layer structure. The first layer is a 3D printed lossy material, the second layer is an air gap, and the third layer is a ground plane. By changing the geometrical parameters of the 3D printed layer, it is possible to tune the frequency of the absorption band of the FSS. ",

keywords = "3D printing, conductive lossy material, frequency selective surface, radiated emissions",

author = "Rui Mi and Wei Zhang and Kaustav Ghosh and Sameer Walunj and Qian Liu and Jacques Rollin and Philippe Sochoux and David Pommerenke and Victor Khilkevich",

note = "Funding Information: ACKNOWLEDGMENT This paper is based upon work supported partially by the National Science Foundation under Grant No. IIP-1916535. Publisher Copyright: {\textcopyright} 2021 IEEE.; 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe : EMC/SI/PI/EMC Europe 2021, EMC/SI/PI/EMC Europe 2021 ; Conference date: 26-07-2021 Through 20-08-2021",

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3D Printed Electromagnetic Absorber Built with Conductive Carbon-filled Filament

Abstract

Publication series

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Keywords

ASJC Scopus subject areas

Access to Document

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3D Printed Multilayer Microwave Absorber

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