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Collaborations and top research areas from the last five years
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Building an Education Ecosystem for Next Generation Microelectronics Experts in Green and Circular Economy with Digitally-Supported Teaching Methods for Sustainable Chips and Applications (EU Project GreenChips-EDU)
Hofmann, K., Keil, F., Riehl, D., Michalowska-Forsyth, A., Czepl, N., Woywod, S., Zupan, D., Casu, M. R., Ricciardi, C., Violante, M., Graziano, M., Ardesi, Y., Mo, F., Berger, D., Sill, S., Visotschnig, V., Morfouli, P., Prejbeanu, L., Morin-Allory, K. & Chavet, C. & 30 others, , 26 Feb 2025, (E-pub ahead of print) 2024 IEEE Frontiers in Education Conference, FIE 2024 - Proceedings. IEEE, (Proceedings - Frontiers in Education Conference, FIE).Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review
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Characterisation of an EMI-Improved Integrated Folded Cascode Amplifier Structure Using the EMIRR Measurement Method
Zupan, D., Czepl, N. & Deutschmann, B., Oct 2024, 2024 14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2024. IEEE, p. 1-4 4 p. (2024 14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review
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Effects of Ionizing Radiation on the EMI-Induced Offset Voltage of Operational Amplifiers
Czepl, N., Zupan, D., Michalowska-Forsyth, A. M. & Deutschmann, B., Oct 2024, 2024 14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2024. IEEE, p. 111-115 5 p. (2024 14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review
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A Method to Measure the Electromagnetic Emission Induced by Electromagnetic Interference of Integrated Circuits
Kircher, D., Czepl, N., Zupan, D. & Deutschmann, B., 2023, (E-pub ahead of print) 2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference and Compatibility, APEMC/INCEMIC 2023. IEEE, 4 p.Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review
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EMI Induced Electromagnetic Emission of ICs in non fail states
Kircher, D., Czepl, N. & Zupan, D., 27 Sept 2023, 20. EMV-Fachtagung: störungsfreie Elektronik und Geräte : 27.-28. September 2023, Seibersdorf Laboratories. Lamedschwandner, K. (ed.). Wien: Österreichischer Verband für Elektrotechnik, p. 40 1 p. (OVE-Schriftenreihe; vol. 110).Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review
Activities
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Characterisation of an EMI-Improved Integrated Folded Cascode Amplifier Structure Using the EMIRR Measurement Method
Zupan, D. (Speaker)
7 Oct 2024Activity: Talk or presentation › Talk at conference or symposium › Science to science
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14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2024
Zupan, D. (Participant), Czepl, N. (Participant), Deutschmann, B. (Member of programme committee), Pfeifer, M. (Participant), Kircher, D. (Participant) & Hameed, M. (Participant)
7 Oct 2024 → 9 Oct 2024Activity: Participation in or organisation of › Conference or symposium (Participation in/Organisation of)
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Young Leaders Programme 2024
Zupan, D. (Participant) & Czepl, N. (Participant)
10 Sept 2024 → 8 Nov 2024Activity: Participation in or organisation of › Professional training and personal development
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32nd Austrian Workshop on Microelectronics, Austrochip 2024
Zupan, D. (Participant) & Czepl, N. (Participant)
25 Sept 2024 → 26 Sept 2024Activity: Participation in or organisation of › Conference or symposium (Participation in/Organisation of)
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2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design
Kircher, D. (Participant), Czepl, N. (Participant) & Zupan, D. (Participant)
3 Jul 2023 → 5 Jul 2023Activity: Participation in or organisation of › Conference or symposium (Participation in/Organisation of)
Prizes
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Mind the Gap Diversity Award 2022
Zupan, D. (Recipient), Haubenwallner, C. (Recipient), Koffler, S. (Recipient), Czepl, N. (Recipient) & Fuchs, M. (Recipient), 20 Oct 2022
Prize: Prizes / Medals / Awards
Press/Media
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Videos on Semiconductor Design by TU Graz on METIS Website
Zupan, D., Deutschmann, B., Michalowska-Forsyth, A. M., Fuchs, M. & Schrey, P.
15/12/20
1 item of Media coverage
Press/Media: Press / Media
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SEMI, PARTNERS LAUNCH LARGEST MICROELECTRONICS EDUCATION INITIATIVE CO-FUNDED BY ERASMUS+ PROGRAM
Zupan, D., Deutschmann, B. & Michalowska-Forsyth, A. M.
19/11/18
1 item of Media coverage
Press/Media: Press / Media
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TU Graz Forscht bei MedAustron in Wiener Neustadt: TU Graz erforscht die Strahlungsfestigkeit von Schaltkreisen
Bezhenova, V., Michalowska-Forsyth, A. M., Reisenhofer, T., Schlager, B., Zupan, D., Dorner, E., Deutschmann, B. & Auer, M.
31/03/18
1 item of Media coverage
Press/Media: Press / Media