TY - GEN
T1 - Transmission Line Based CDM ESD Current Target to Overcome Bandwidth Limitations
AU - Fellner, Gabriel
AU - Pommerenke, David Johannes
AU - Zeitlhoefler, Lena
AU - Zur Nieden, Friedrich
PY - 2024/9/5
Y1 - 2024/9/5
N2 - Reducing charged device model (CDM) electrostatic discharge (ESD) target levels for advanced integrated circuits (ICs) and systems on chip (SoCs) enables cost-effective manufacturing. Notably fast rise times, as low as 20 ps, have been observed for CDM events below 250 V. Previous investigations have highlighted fast rise times as critical parameters for damage in CDM testing of devices. These rapid rise times result in spectral frequency content exceeding 17.5 GHz, surpassing the bandwidth of existing CDM current targets employing disk resistors. To overcome this bandwidth limitation, a CDM current target comprised of parallel-connected transmission lines has been developed. Full-wave simulation results confirm the design of an initial prototype. Time-domain measurements conducted in an experimental setup exhibit exemplary results, with potential for further enhancement through de-embedding techniques.
AB - Reducing charged device model (CDM) electrostatic discharge (ESD) target levels for advanced integrated circuits (ICs) and systems on chip (SoCs) enables cost-effective manufacturing. Notably fast rise times, as low as 20 ps, have been observed for CDM events below 250 V. Previous investigations have highlighted fast rise times as critical parameters for damage in CDM testing of devices. These rapid rise times result in spectral frequency content exceeding 17.5 GHz, surpassing the bandwidth of existing CDM current targets employing disk resistors. To overcome this bandwidth limitation, a CDM current target comprised of parallel-connected transmission lines has been developed. Full-wave simulation results confirm the design of an initial prototype. Time-domain measurements conducted in an experimental setup exhibit exemplary results, with potential for further enhancement through de-embedding techniques.
UR - https://www.scopus.com/pages/publications/85208427282
U2 - 10.1109/EMCEurope59828.2024.10722655
DO - 10.1109/EMCEurope59828.2024.10722655
M3 - Conference paper
T3 - Proceedings of the International Symposium on Electromagnetic Compatibility, EMC Europe
SP - 640
EP - 645
BT - Proceedings of the International Symposium on Electromagnetic Compatibility, EMC Europe
PB - IEEE
T2 - 2024 International Symposium on Electromagnetic Compatibility, EMC Europe 2024
Y2 - 2 September 2024 through 5 September 2024
ER -