Enhancement of the DPI method for IC immunity characterization

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Originalsprache	englisch
Titel	Proc. of International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2017)
Seiten	178-183
DOIs	https://doi.org/10.1109/EMCCompo.2017.7998106
Publikationsstatus	Veröffentlicht - 6 Juli 2017

ASJC Scopus subject areas

@inproceedings{0897f9e9d56e4c4d9165064488640f6e,

title = "Enhancement of the DPI method for IC immunity characterization",

author = "Andrea Lavarda and Bernd Deutschmann and Dieter Haerle",

year = "2017",

month = jul,

day = "6",

doi = "10.1109/EMCCompo.2017.7998106",

language = "English",

pages = "178--183",

booktitle = "Proc. of International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2017)",

}

TY - GEN

T1 - Enhancement of the DPI method for IC immunity characterization

AU - Lavarda, Andrea

AU - Deutschmann, Bernd

AU - Haerle, Dieter

PY - 2017/7/6

Y1 - 2017/7/6

U2 - 10.1109/EMCCompo.2017.7998106

DO - 10.1109/EMCCompo.2017.7998106

M3 - Conference paper

SP - 178

EP - 183

BT - Proc. of International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2017)

ER -