Dust Figure Guided Modeling of Corona Discharge on Touchscreen Surface

  • Zhekun Peng*
  • , Jianchi Zhou
  • , Darryl Kostka
  • , David Pommerenke
  • , Daryl Beetner
  • *Korrespondierende/r Autor/-in für diese Arbeit

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem KonferenzbandBegutachtung

Abstract

Electrostatic discharge to a touchscreen display leads to a corona discharge which creates corona streamers that| propagate along the glass surface. The streamers couple energy to touch sensors underneath the glass which may then cause failure. Modeling the ionized air resistance and the current distribution on the glass surface from corona discharge is challenging. A new methodology is proposed for modeling corona discharge to a touchscreen surface with the help of experimentally measured dust figures. A geometric analysis of the dust figure and how streamer currents couple to the sensor patch matrix is given to explain the modeling method. A SPICE model is proposed to better correlate the ESD gun current with the current coupled to the sensor patches. The ability of the model to predict peak current, charge and rise time is evaluated. Predictions of peak current and charge are within 30% error.

Originalspracheenglisch
Titel2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal and Power Integrity
UntertitelEMC Japan/Asia Pacific International Symposium on Electromagnetic Compatibility, EMC Japan/APEMC Okinawa 2024 - Proceedings
Herausgeber (Verlag)IEEE
Seiten365-368
Seitenumfang4
ISBN (elektronisch)9784885523472
DOIs
PublikationsstatusVeröffentlicht - 2024
Veranstaltung2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal and Power Integrity: EMC Japan/Asia Pacific International Symposium on Electromagnetic Compatibility: EMC Japan/APEMC Okinawa 2024 - Okinawa, Japan
Dauer: 20 Mai 202424 Mai 2024

Konferenz

Konferenz2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal and Power Integrity: EMC Japan/Asia Pacific International Symposium on Electromagnetic Compatibility
Land/GebietJapan
OrtOkinawa
Zeitraum20/05/2424/05/24

ASJC Scopus subject areas

  • Hardware und Architektur
  • Signalverarbeitung
  • Energieanlagenbau und Kraftwerkstechnik
  • Elektrotechnik und Elektronik
  • Sicherheit, Risiko, Zuverlässigkeit und Qualität
  • Strahlung

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