Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis

Runbing Hua; Omid Hoseini Izadi; Zhekun Peng; Hideki Shumiya; Shota  Konno; Kenji Araki; David Johannes Pommerenke; DongHyun Kim

doi:10.1109/EMCSI38923.2020.9191592

Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis

Runbing Hua
, Omid Hoseini Izadi
, Zhekun Peng
, Hideki Shumiya
, Shota Konno
, Kenji Araki
, David Johannes Pommerenke
, DongHyun Kim

Institut für Elektronik (4390)

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Abstract

An electrostatic discharge (ESD) happening on a commercial electronic device such as at the USB interface can induce soft-failure in the IC and disturb the normal operation of the device. This paper investigates the soft-failure behaviors of 14 commercial USB devices in order to obtain an insight into the overall sensitivity trend of such systems and into the severity of different soft-failures. A new analysis method is proposed in this paper. The considered parameters in this study include: injected pulse widths, pulse rise time, current levels, USB standard of the DUTS, etc. Soft-failures started to occur at a current of around 1 A, and nearly all configurations would show errors above 6 A.

Originalsprache	englisch
Titel	2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020
Seiten	200-204
Seitenumfang	5
ISBN (elektronisch)	978-1-7281-7430-3
DOIs	https://doi.org/10.1109/EMCSI38923.2020.9191592
Publikationsstatus	Veröffentlicht - Juli 2020
Veranstaltung	2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity: EMCSI 2020 - Virtual, Reno, USA / Vereinigte Staaten Dauer: 27 Juli 2020 → 31 Juli 2020

Konferenz

Konferenz	2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity
Kurztitel	EMCSI 2020
Land/Gebiet	USA / Vereinigte Staaten
Ort	Virtual, Reno
Zeitraum	27/07/20 → 31/07/20

ASJC Scopus subject areas

Informationssysteme und -management
Sicherheit, Risiko, Zuverlässigkeit und Qualität
Signalverarbeitung
Strahlung
Elektrotechnik und Elektronik

Zugriff auf Dokument

10.1109/EMCSI38923.2020.9191592

Andere Dateien und Links

https://www.scopus.com/pages/publications/85091866054

Dieses zitieren

Hua, R., Izadi, O. H., Peng, Z., Shumiya, H., Konno, S., Araki, K., Pommerenke, D. J., & Kim, D. (2020). Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis. in 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020 (S. 200-204). Artikel 9191592 https://doi.org/10.1109/EMCSI38923.2020.9191592

Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis. / Hua, Runbing; Izadi, Omid Hoseini; Peng, Zhekun et al.
2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020. 2020. S. 200-204 9191592.

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Hua, R, Izadi, OH, Peng, Z, Shumiya, H, Konno, S, Araki, K, Pommerenke, DJ & Kim, D 2020, Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis. in 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020., 9191592, S. 200-204, 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity, Virtual, Reno, USA / Vereinigte Staaten, 27/07/20. https://doi.org/10.1109/EMCSI38923.2020.9191592

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title = "Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis",

abstract = "An electrostatic discharge (ESD) happening on a commercial electronic device such as at the USB interface can induce soft-failure in the IC and disturb the normal operation of the device. This paper investigates the soft-failure behaviors of 14 commercial USB devices in order to obtain an insight into the overall sensitivity trend of such systems and into the severity of different soft-failures. A new analysis method is proposed in this paper. The considered parameters in this study include: injected pulse widths, pulse rise time, current levels, USB standard of the DUTS, etc. Soft-failures started to occur at a current of around 1 A, and nearly all configurations would show errors above 6 A.",

keywords = "electrostatic discharge, soft-failure, USB IC susceptibility",

author = "Runbing Hua and Izadi, \{Omid Hoseini\} and Zhekun Peng and Hideki Shumiya and Shota Konno and Kenji Araki and Pommerenke, \{David Johannes\} and DongHyun Kim",

year = "2020",

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doi = "10.1109/EMCSI38923.2020.9191592",

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booktitle = "2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020",

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AU - Hua, Runbing

AU - Izadi, Omid Hoseini

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AU - Konno, Shota

AU - Araki, Kenji

AU - Pommerenke, David Johannes

AU - Kim, DongHyun

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AB - An electrostatic discharge (ESD) happening on a commercial electronic device such as at the USB interface can induce soft-failure in the IC and disturb the normal operation of the device. This paper investigates the soft-failure behaviors of 14 commercial USB devices in order to obtain an insight into the overall sensitivity trend of such systems and into the severity of different soft-failures. A new analysis method is proposed in this paper. The considered parameters in this study include: injected pulse widths, pulse rise time, current levels, USB standard of the DUTS, etc. Soft-failures started to occur at a current of around 1 A, and nearly all configurations would show errors above 6 A.

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BT - 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020

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ER -

Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis

Abstract

Konferenz

ASJC Scopus subject areas

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