A temperature analysis for NFC-powered smart lab-on-chip devices

Carolin Kollegger; Christoph Steffan; Philipp Greiner; Clemens Rabl; David Lugitsch; Gerald Holweg; Bernd Deutschmann

doi:10.1109/MWSCAS.2018.8623976

A temperature analysis for NFC-powered smart lab-on-chip devices

Carolin Kollegger
, Christoph Steffan
, Philipp Greiner
, Clemens Rabl
, David Lugitsch
, Gerald Holweg
, Bernd Deutschmann

Institut für Elektronik (4390)

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Abstract

This paper presents a temperature analysis for NFC-powered Lab-on-Chip (LoC) solutions. It is based on a monolithically implemented LoC and uses a 130 nm standard CMOS process. The LoC has an active chip area of 6.24 mm ² . An application-independent temperature gathering mesh is implemented on the chip substrate. It allows a real time NFC-caused temperature analysis. Measurement data regarding heat spreading, the influence of the glob top, and the effect of the PCB layout is presented. A warming reduction from 23.05°C to 3.8°C using the same power source is achieved. Detailed data on the temperature gradient over time for warming and cooling is also provided.

Originalsprache	englisch
Titel	2018 IEEE 61st International Midwest Symposium on Circuits and Systems, MWSCAS 2018
Herausgeber (Verlag)	IEEE
Seiten	1058-1061
Seitenumfang	4
Band	2018-August
ISBN (elektronisch)	9781538673928
DOIs	https://doi.org/10.1109/MWSCAS.2018.8623976
Publikationsstatus	Veröffentlicht - 22 Jan. 2019
Veranstaltung	61st IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2018 - Windsor, Kanada Dauer: 5 Aug. 2018 → 8 Aug. 2018

Konferenz

Konferenz	61st IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2018
Land/Gebiet	Kanada
Ort	Windsor
Zeitraum	5/08/18 → 8/08/18

ASJC Scopus subject areas

Elektronische, optische und magnetische Materialien
Elektrotechnik und Elektronik

Zugriff auf Dokument

10.1109/MWSCAS.2018.8623976

Andere Dateien und Links

https://www.scopus.com/pages/publications/85062234817

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Kollegger, C, Steffan, C, Greiner, P, Rabl, C, Lugitsch, D, Holweg, G & Deutschmann, B 2019, A temperature analysis for NFC-powered smart lab-on-chip devices. in 2018 IEEE 61st International Midwest Symposium on Circuits and Systems, MWSCAS 2018. Bd. 2018-August, 8623976, IEEE, S. 1058-1061, 61st IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2018, Windsor, Kanada, 5/08/18. https://doi.org/10.1109/MWSCAS.2018.8623976

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title = "A temperature analysis for NFC-powered smart lab-on-chip devices",

abstract = " This paper presents a temperature analysis for NFC-powered Lab-on-Chip (LoC) solutions. It is based on a monolithically implemented LoC and uses a 130 nm standard CMOS process. The LoC has an active chip area of 6.24 mm 2 . An application-independent temperature gathering mesh is implemented on the chip substrate. It allows a real time NFC-caused temperature analysis. Measurement data regarding heat spreading, the influence of the glob top, and the effect of the PCB layout is presented. A warming reduction from 23.05°C to 3.8°C using the same power source is achieved. Detailed data on the temperature gradient over time for warming and cooling is also provided. ",

keywords = "130 nm, CMOS, Lab-on-chip, NFC",

author = "Carolin Kollegger and Christoph Steffan and Philipp Greiner and Clemens Rabl and David Lugitsch and Gerald Holweg and Bernd Deutschmann",

year = "2019",

month = jan,

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doi = "10.1109/MWSCAS.2018.8623976",

language = "English",

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booktitle = "2018 IEEE 61st International Midwest Symposium on Circuits and Systems, MWSCAS 2018",

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note = "61st IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2018 ; Conference date: 05-08-2018 Through 08-08-2018",

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TY - GEN

T1 - A temperature analysis for NFC-powered smart lab-on-chip devices

AU - Kollegger, Carolin

AU - Steffan, Christoph

AU - Greiner, Philipp

AU - Rabl, Clemens

AU - Lugitsch, David

AU - Holweg, Gerald

AU - Deutschmann, Bernd

PY - 2019/1/22

Y1 - 2019/1/22

N2 - This paper presents a temperature analysis for NFC-powered Lab-on-Chip (LoC) solutions. It is based on a monolithically implemented LoC and uses a 130 nm standard CMOS process. The LoC has an active chip area of 6.24 mm 2 . An application-independent temperature gathering mesh is implemented on the chip substrate. It allows a real time NFC-caused temperature analysis. Measurement data regarding heat spreading, the influence of the glob top, and the effect of the PCB layout is presented. A warming reduction from 23.05°C to 3.8°C using the same power source is achieved. Detailed data on the temperature gradient over time for warming and cooling is also provided.

AB - This paper presents a temperature analysis for NFC-powered Lab-on-Chip (LoC) solutions. It is based on a monolithically implemented LoC and uses a 130 nm standard CMOS process. The LoC has an active chip area of 6.24 mm 2 . An application-independent temperature gathering mesh is implemented on the chip substrate. It allows a real time NFC-caused temperature analysis. Measurement data regarding heat spreading, the influence of the glob top, and the effect of the PCB layout is presented. A warming reduction from 23.05°C to 3.8°C using the same power source is achieved. Detailed data on the temperature gradient over time for warming and cooling is also provided.

KW - 130 nm

KW - CMOS

KW - Lab-on-chip

KW - NFC

UR - https://www.scopus.com/pages/publications/85062234817

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BT - 2018 IEEE 61st International Midwest Symposium on Circuits and Systems, MWSCAS 2018

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T2 - 61st IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2018

Y2 - 5 August 2018 through 8 August 2018

ER -

A temperature analysis for NFC-powered smart lab-on-chip devices

Abstract

Konferenz

ASJC Scopus subject areas

Zugriff auf Dokument

Andere Dateien und Links

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