3D Printed Electromagnetic Absorber Built with Conductive Carbon-filled Filament

Rui Mi; Wei Zhang; Kaustav Ghosh; Sameer Walunj; Qian Liu; Jacques Rollin; Philippe Sochoux; David Pommerenke; Victor Khilkevich

doi:10.1109/EMC/SI/PI/EMCEurope52599.2021.9559309

3D Printed Electromagnetic Absorber Built with Conductive Carbon-filled Filament

Rui Mi
, Wei Zhang
, Kaustav Ghosh
, Sameer Walunj
, Qian Liu
, Jacques Rollin
, Philippe Sochoux
, David Pommerenke
, Victor Khilkevich

Institut für Elektronik (4390)

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Abstract

This article presents a method for manufacturing a frequency selective surface (FSS) using the 3D printing technology, including material characterization, design, fabrication, and evaluation. The FSS design is based on a three-layer structure. The first layer is a 3D printed lossy material, the second layer is an air gap, and the third layer is a ground plane. By changing the geometrical parameters of the 3D printed layer, it is possible to tune the frequency of the absorption band of the FSS.

Originalsprache	englisch
Titel	2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021
Herausgeber (Verlag)	IEEE
Seiten	266-271
Seitenumfang	6
ISBN (elektronisch)	9781665448888
DOIs	https://doi.org/10.1109/EMC/SI/PI/EMCEurope52599.2021.9559309
Publikationsstatus	Veröffentlicht - 26 Juli 2021
Veranstaltung	2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe: EMC/SI/PI/EMC Europe 2021 - Raleigh, USA / Vereinigte Staaten Dauer: 26 Juli 2021 → 20 Aug. 2021

Publikationsreihe

Name	2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021

Konferenz

Konferenz	2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe
Kurztitel	EMC/SI/PI/EMC Europe 2021
Land/Gebiet	USA / Vereinigte Staaten
Ort	Raleigh
Zeitraum	26/07/21 → 20/08/21

ASJC Scopus subject areas

Signalverarbeitung
Energieanlagenbau und Kraftwerkstechnik
Luft- und Raumfahrttechnik
Elektrotechnik und Elektronik
Sicherheit, Risiko, Zuverlässigkeit und Qualität
Strahlung

Zugriff auf Dokument

10.1109/EMC/SI/PI/EMCEurope52599.2021.9559309

Andere Dateien und Links

Verknüpfung zur Publikation in Scopus

3D Printed Multilayer Microwave Absorber
Zhang, W., Mi, R. & Khilkevich, V., 5 Aug. 2022, 2022 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2022. ACM/IEEE, S. 59-63 5 S. 9889603. (2022 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2022).
Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Dieses zitieren

Mi, R., Zhang, W., Ghosh, K., Walunj, S., Liu, Q., Rollin, J., Sochoux, P., Pommerenke, D., & Khilkevich, V. (2021). 3D Printed Electromagnetic Absorber Built with Conductive Carbon-filled Filament. in 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021 (S. 266-271). (2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021). IEEE. https://doi.org/10.1109/EMC/SI/PI/EMCEurope52599.2021.9559309

3D Printed Electromagnetic Absorber Built with Conductive Carbon-filled Filament. / Mi, Rui; Zhang, Wei; Ghosh, Kaustav et al.
2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021. IEEE, 2021. S. 266-271 (2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021).

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Mi, R, Zhang, W, Ghosh, K, Walunj, S, Liu, Q, Rollin, J, Sochoux, P, Pommerenke, D & Khilkevich, V 2021, 3D Printed Electromagnetic Absorber Built with Conductive Carbon-filled Filament. in 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021. 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021, IEEE, S. 266-271, 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, Raleigh, USA / Vereinigte Staaten, 26/07/21. https://doi.org/10.1109/EMC/SI/PI/EMCEurope52599.2021.9559309

Mi R, Zhang W, Ghosh K, Walunj S, Liu Q, Rollin J et al. 3D Printed Electromagnetic Absorber Built with Conductive Carbon-filled Filament. in 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021. IEEE. 2021. S. 266-271. (2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021). doi: 10.1109/EMC/SI/PI/EMCEurope52599.2021.9559309

Mi, Rui ; Zhang, Wei ; Ghosh, Kaustav et al. / 3D Printed Electromagnetic Absorber Built with Conductive Carbon-filled Filament. 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021. IEEE, 2021. S. 266-271 (2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021).

@inproceedings{800fbb3eccd04aad9799e73ae4187756,

title = "3D Printed Electromagnetic Absorber Built with Conductive Carbon-filled Filament",

abstract = "This article presents a method for manufacturing a frequency selective surface (FSS) using the 3D printing technology, including material characterization, design, fabrication, and evaluation. The FSS design is based on a three-layer structure. The first layer is a 3D printed lossy material, the second layer is an air gap, and the third layer is a ground plane. By changing the geometrical parameters of the 3D printed layer, it is possible to tune the frequency of the absorption band of the FSS. ",

keywords = "3D printing, conductive lossy material, frequency selective surface, radiated emissions",

author = "Rui Mi and Wei Zhang and Kaustav Ghosh and Sameer Walunj and Qian Liu and Jacques Rollin and Philippe Sochoux and David Pommerenke and Victor Khilkevich",

note = "Funding Information: ACKNOWLEDGMENT This paper is based upon work supported partially by the National Science Foundation under Grant No. IIP-1916535. Publisher Copyright: {\textcopyright} 2021 IEEE.; 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe : EMC/SI/PI/EMC Europe 2021, EMC/SI/PI/EMC Europe 2021 ; Conference date: 26-07-2021 Through 20-08-2021",

year = "2021",

month = jul,

day = "26",

doi = "10.1109/EMC/SI/PI/EMCEurope52599.2021.9559309",

language = "English",

series = "2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021",

publisher = "IEEE",

pages = "266--271",

booktitle = "2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021",

address = "United States",

}

TY - GEN

T1 - 3D Printed Electromagnetic Absorber Built with Conductive Carbon-filled Filament

AU - Mi, Rui

AU - Zhang, Wei

AU - Ghosh, Kaustav

AU - Walunj, Sameer

AU - Liu, Qian

AU - Rollin, Jacques

AU - Sochoux, Philippe

AU - Pommerenke, David

AU - Khilkevich, Victor

PY - 2021/7/26

Y1 - 2021/7/26

N2 - This article presents a method for manufacturing a frequency selective surface (FSS) using the 3D printing technology, including material characterization, design, fabrication, and evaluation. The FSS design is based on a three-layer structure. The first layer is a 3D printed lossy material, the second layer is an air gap, and the third layer is a ground plane. By changing the geometrical parameters of the 3D printed layer, it is possible to tune the frequency of the absorption band of the FSS.

AB - This article presents a method for manufacturing a frequency selective surface (FSS) using the 3D printing technology, including material characterization, design, fabrication, and evaluation. The FSS design is based on a three-layer structure. The first layer is a 3D printed lossy material, the second layer is an air gap, and the third layer is a ground plane. By changing the geometrical parameters of the 3D printed layer, it is possible to tune the frequency of the absorption band of the FSS.

KW - 3D printing

KW - conductive lossy material

KW - frequency selective surface

KW - radiated emissions

UR - https://www.scopus.com/pages/publications/85118396410

U2 - 10.1109/EMC/SI/PI/EMCEurope52599.2021.9559309

DO - 10.1109/EMC/SI/PI/EMCEurope52599.2021.9559309

M3 - Conference paper

AN - SCOPUS:85118396410

T3 - 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021

SP - 266

EP - 271

BT - 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021

PB - IEEE

T2 - 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe

Y2 - 26 July 2021 through 20 August 2021

ER -

3D Printed Electromagnetic Absorber Built with Conductive Carbon-filled Filament

Abstract

Publikationsreihe

Konferenz

ASJC Scopus subject areas

Zugriff auf Dokument

Andere Dateien und Links

Fingerprint

Publikationen

3D Printed Multilayer Microwave Absorber

Dieses zitieren